July 1993, B. Sc., Jilin University of Technology, Changchun, China.
July 1996, M.Sc., Dalian Railway Institute, Dalian, China.
Apr. 2000, Ph.D., Dalian Maritime University, Dalian, China.
July 1996- July 2000, Assistant/Lecture, Dalian Railway Institute, Dalian, China
Sep.2000-Jun.2002, Postdoctoral Research Associate, Okayama University of Science, Okayama, Japan.
Jul.2002-Mar.2007, Research Fellow, National Institute for Materials Science (NIMS), Tsukuba, Japan.
Dec.2006-Present, Professor, Institute of Metal Research (IMR), Chinese Academy of Sciences (CAS), Shenyang, China
Nov.2013-Jan.2014, Visiting Professor, Osaka University, Osaka, Japan
1. Microstructure and reliability of advanced interconnection materials. The interfacial reaction of solder joint, IMC growth and transformation, voids formation, elemental diffusion and segregation, were investigated in detail. Efforts are made to understand the reliability of interconnect materials under thermal, mechanical and electrical fields.,
2. Property related microstructure characterization and phase transformation. The microstructure, precipitation behavior, phase transformation, crystal structure (superstructure), and defects in alloys and nanomaterials were studied mainly with transmission electron microscopy (TEM). ,
3. Materials synthesis and nanofabrication using focused electron beam. The electron-stimulated oxidation and ion-irradiation induced phase transformation were in-situ studied in TEM. Electron beam induced deposition (EBID) was also carried out to fabricate different nanostructures like nano-dot, nano-wire, nano-supertip, et